Semiconductor & Digital Infrastructure

Digital infrastructure components — ICs, Optical modules, Displays, Automation electronics, EU-conformant.

Semiconductor Packaging & ICs

SiP system-in-package · 2.5D/3D advanced packaging substrates · BGA packaging substrates · Flip-chip interposers · IC packaging consistency testing

Optical Communication Components

800G/1.6T optical modules (>60% global share) · Fiber transceivers · CWDM/DWDM filters · Silicon photonic chips · Fiber patch cord arrays

LED & Display Modules

Mini-LED backlight modules · Micro-LED direct-display panels · COB LED arrays · OLED flexible screens · LED driver ICs

Industrial Automation Electronics

PLC programmable controllers · Servo drive units · Stepper motor drivers · Industrial IoT gateways · HMI touch panels

Electronic Components & Sensors

MEMS multi-axis sensors · Temp/humidity sensor modules · Inertial measurement units (IMU) · Hall-effect sensors · Accelerometers

PCB & Circuit Modules

Multi-layer HDI PCBs · Flexible circuit boards (FPC) · High-frequency RF PCBs · Metal-core PCBs (MCPCB) · Rigid-flex boards

Our services

Verify factory capacity & export credentials on-site; Sample-test IC packaging quality consistency; Issue EU RoHS/REACH compliance documentation; Arrange small-batch trial production orders; Professionally review product spec parameters.

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Custom & Innovation Procurement

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